BNFCorporation

제품소개

Paste
Classification Description Alloy Composition
(wt,%)
Particle
Size
Characteristic
SMT Medium Temp. &
Sn-Ag-Cu Alloy
LST309M-K21 Sn-3.0Ag-0.5Cu Type 4
(30~38㎛)

Type 5
(15~25㎛)

Type 6
(5~15㎛)
For SMD (Falling Proof
LST309-M For General Use
Halogen Free
LST305-ERHF04
LST309M-K21D5 Mn, Void
LST105-ST09 Sn-1,0Ag-0.5Cu Low, Ag
LST0307-TG01 Sn-0.3Ag-0.7Cu
LST30-T 7 Sn-3.0Ag-0.5Cu Type 7
(2~11㎛)
For Microparts
Low Temp. LST-57A Sn-57Bi-1Ag Type 4
(20~38㎛)

Type 5
(15~25㎛)
For Low Temp.
SMD&nozzie Mask
(PIP & SMT) LBI04-M08E Sn-57Bi-0.4Ag-X
Water Soluble LST305-WS Sn-3.0Ag-0.5Cu Water Soluble
High Reliable Acrylic LST305-T4AKHG-18Z High Reliability for
Autotronic Use
Semi
conductor
Medium Temp. &
Sn-Ag-Cu Alloy
LST305-ER-HX Sn-3.0Ag-0.5Cu Type 4~7 Min, Flux Residue
Water Soluble LST305-WS7
LST305-WS-T7 For Bump